Low-temperature low-pressure molding hot melt (Viroshot) for electronic components
Achieving both lightweight electronic components and protection! IP68 compliant hot melt.
Low-pressure encapsulation molding material, Biroshot, is optimal for protecting electronic components. Traditional potting methods and injection molding can pose challenges such as increased weight and damage to electronic components due to heat during molding. Low-temperature, low-pressure molding hot melt (Biroshot) addresses these issues, achieving both lightweight and protective performance. Using Biroshot for production molds allows for further productivity improvements with Adron coating (release film). 【Application Scenarios】 - Sealing of automotive electronic devices - Protection of components requiring lightweight design - Components needing waterproof and dustproof performance 【Benefits of Implementation】 - Reduced damage to electronic components - Thinning, miniaturization, and weight reduction - Cost reduction and time savings
- Company：フロロコート
- Price：Other
